A cordless carrier-type that upends the concept of the conventional electrostatic chuck. Integrating into manufacturing lines for power semiconductors enables the manufacturing of extremely thin semiconductors to enable high-performance IBGT and MOSFET manufacturing with lower energy loss. We propose systems that include automation for manufacturing line integration.
Powerful suction enables the maintenance and machining of work that is difficult to process, such as fragile glass for increasingly thin displays or film and metal foils that are susceptible to wrinkling. We help improve productivity at manufacturing sites around the world.
We offer various products including a handheld "soft palm" for adsorption to small thin workpieces, a "cordless holder" featuring an electrostatic chuck combined with a power supply, and an "electrostatic belt" for replacing rollers in printing machines.
Problems that can be addressed with an electrostatic chuck (product FAQ)
An electrostatic chuck can generate a stable adsorption force in a vacuum that is not possible with a vacuum chuck. We provide proposals for elements such as the stage and Supporter based on conditions.
An electrostatic chuck uses surface adsorption, so it does not apply localized stress.
Adsorption varies depending on the material but we will conduct an assessment if you provide a sample. Please feel free to consult us.
A warped wafer can be corrected by using a Supporter.
Using Supporter to reinforce the wafer can eliminate the need for outer circumference reinforcement.
Using Supporter eliminates the need for expensive dedicated equipment. You can achieve the latest thin wafer processing using existing equipment. The ability to use existing equipment enables cost reductions.
Warping can be corrected by using Supporter.
We offer cordless products for in-line facility stages including Supporters and battery motor stages.
An electrostatic chuck uses surface adsorption, so it does not apply localized stress.
Adsorption can be maintained without causing stress on thin work.
An electrostatic chuck uses surface adsorption, so it does not apply localized stress.
As such, there are no absorption marks.
An electrostatic chuck uses surface adsorption, so it does not apply localized stress.
As such, there are no absorption wrinkles.
The adsorption force of our electrostatic chucks is limited to several μof the surface of the contact work.
The work reverse side is not impacted so it is possible to pick up a single piece from a layered stack.
Applicability depends on work conditions. Please feel free to conduct us for a preliminary assessment.
The electrostatic chuck operates without problem in a vacuum environment, heated environments (200°C or less), UV environments, and low humidity environments.
The electrostatic chuck uses surface adsorption, which enables easy adsorption of materials with holes or porous materials that cannot be fixed and held by a vacuum chuck.
The electrostatic chuck uses surface adsorption, which enable use regardless of work shape or size.
A single stage can be used for multiple sizes and types.
Using Supporter as a converter tool for various sizes and thickness enables the use of existing equipment without modifications.
Tsukuba Seiko Profile
Using world-class technology to innovate the manufacturing workplace
